TSMC to break ground on Dresden fab in August

“TSMC plans to hold the groundbreaking ceremony for the ESMC’s fab in Dresden, Germany, on August 20,” says TSMC, “this event represents a significant milestone for TSMC and our investment partners in the European semiconductor industry. The ESMC project is on track as planned, with construction expected to start by the end of 2024.”

The fab to be called European Semiconductor Manufacturing Corporation (ESMC) is scheduled to run first silicon in late 2027.

Infineon, Bosch and NXP each put up €500 million for a 10% stake in ESMC which will cost $10.8 billion.

The 40k wpm fab will be set up to run 28nm, 22nm, 16nm and 12nm processes.

The ESMC site is next door to Bosch’s fab while Infineon is also building a mature process fab in Dresden.