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Manufacturing

ST signs up for more Cree silicon carbide wafers

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ST Microelectronics has extended its multi-year silicon carbide wafer deal with Cree, taking it to over $500m in total value. Cree will supply 150mm bare and epitaxial silicon carbide wafers to ST over “several years”, according to Cree. “Expanding our long-term wafer supply agreement with Cree will increase the flexibility of our global silicon carbide substrate supply,” said ST CEO Jean-Marc ...

3D printed PCB service opens in US

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Accucode 3D is to offer 3D printing of electronics for prototyping and low-volume manufacture from locations in Colorado and Texas. This is claimed to be the world’s first service bureau for 3D printing of electronics, by Isreal-based Nano Dimension, whihc has provided the two DragonFly printers that Accucode will be using. “With the DragonFly system’s ability to 3D print conductive ...

Oxford spin-out expands German silicon-perovskite solar cell fab.

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University of Oxford spin-out Oxford PV has ordered more manufacturing equipment for its 125MW silicon-perovskite solar cell production line in Germany, and is planning to double its capacity. The order adds perovskite cell-making equipment to the previously ordered (see below) silicon solar cell production line, and includes development work on both line and process integration, according to Swiss equipment maker ...

Tunnelling transistor offers logic and power on the same easy-to-make IC

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Only eight lithography masks to create a low-power custom logic chips, compared with 20+ for CMOS, is the claim of Nottingham-based fabless chip start-up ‘Search For The Next’ (SFN). As such, production lead time is reduced – the target is two weeks by December 2020, according to company CEO David Summerland. Using just those eight layers, he continued, it is also possible ...

PROPHESEE joins IRT Nanoelec

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PROPHESEE, the  neuromorphic vision specialist, has joined the IRT Nanoelec consortium to help broaden the field of potential applications for 3D hybrid wafer-to-wafer bonding with fine interconnect pitches.  3D integration brings, under a single roof, expertise and equipment addressing the entire 3D integration value chain: technology, circuit architecture, EDA tools, packaging and test. STMicroelectronics (IDM), Mentor (EDA), a Siemens business, ...

Bosch goes SiC

Engineering staff analyzing process results

Bosch is starting production of SiC auto ICs at its plant in Reutlingen, near its Stuttgart HQ, Bosch is in the process of building a $1.1 billion fab in Dresden. First product is planned for late 2021. It will employ 700 staff. Bosch is building a comprehensive portfolio of the full range of ICs for electric, connected and self-driving cars. ...

Plessey builds green and blue micro-LEDs on the same die for augmented reality displays

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UK LED fab Plessey has achieved native – as opposed to phosphor-converter – blue emission and native green emission from the same wafer, a key step en route to effient monolithic micro-displays for virtual reality (VR) googles and augmented reality (AR) glasses – the firm argues that it is in the best position to achieve sufficient brightness to make compact ...