Samsung in mass production of 286-layer V9 QLC NAND

Yesterday Samsung said it has begun mass production of a 286-layer QLC NAND initially for the server market.

Density is 28.5 Gb/mm² – claimed to be  86% higher than its previous generation QLC V-NAND, with  20% higher data retention performance, double the write performance and 60% faster data input and output speed.

The maximum data transfer rate is 3.2 Gbps.


Data read and write power consumption are said to have been reduced by about 30% and 50%, respectively.


Samsung used channel hole etching technology in a double-stack structure.

Samsung is said to be set to unveil 430-layer NAND chips by the end of 2025.


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